Frame cassette

ABSTRACT

The present invention discloses a frame cassette comprising a case, a hollow parallelepiped with an front opening, having a bottom wall and a top wall parallel with each other, and a left side wall, a right side wall and a rear side wall perpendicular to the top wall and the bottom wall; and a plurality of frames for adhering and fixing cut wafers; characterized in that: a positioning hole is disposed on near the boundary between the bottom wall and the left side wall and the right side wall to fix the frame cassette on a personal guided vehicle.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a frame cassette, and moreparticularly, to a frame cassette, which can be transported by aconventional personal guided vehicle.

[0003] 2. Description of Related Art

[0004] In the semiconductor process, the wafer is stored in a cassetteduring transportation to improve the transportation speed of the waferbetween machines or protect the wafer from the particle pollution.Similarly, in the semiconductor package process, the wafer will be cutand then adhered to a frame. Therefore, the frame with those cut wafersis transported with a frame cassette between machines, such as themounting machines and the die-bonding machine. The frame cassette can beloaded into the loading port of the machine for loading the wafer intothe machine directly, so that the particle pollution in the air isavoided.

[0005]FIG. 1 is a perspective view of a conventional frame cassette madeaccording to SEMI G77-0699 standard, comprising a case 11 and aplurality of frames 12. The case 11 is composed of a bottom wall 112 anda top wall 113 parallel with each other, and a left side wall 111, aright side wall 110 and a rear side wall 114 perpendicular to the topwall 113 and the bottom wall 112. In addition, a handle 117 is disposedon the top wall 113 of the case for holding. And, a fasten means (notshown) is disposed on the bottom wall 112 to position the frame cassette10 on the loading port for loading the wafer into the machine. Moreover,a plurality of grooves are correspondingly disposed inside of the leftside wall 111 and the right side wall 110 of the case 11 for placing theplurality of the frames, so that the breakage of the wafer due to theframe friction is avoided. A fastener 116 is disposed on the front sideof the left side wall 111 to fasten the frame 12 in the frame cassette10, so that the frame shaking or falling out of the frame cassette 10 isavoided.

[0006] The cassette can be loaded into the machines directly, when it istransported with a personal guided vehicle. The conventional personalguided vehicle, as shown in FIG. 2(a), comprises a supporting means 21,a handle 22, and wheels 23. The supporting means 21 comprises a housing210, two frame arms 211, and two sliding trenches 212. The housing 210is a hollow parallelepiped with an opening. Thus, the cassette can bemoved into the personal guided vehicle from the opening of the housing210. Two frame arms 211 are disposed on the left and the right sides ofthe bottom of the housing 210, respectively. The sliding trench 212 isbuckled in the frame arm 211, so that the sliding trench 212 can slideon the frame arm 211 forwards and backwards. Two protrusions 213 areoppositely disposed in the sliding trench 212, as shown in FIG. 2(b).The cassette can be moved from the opening of the housing 210 by a robotand positioned by the protrusion 213 of the sliding trench 212. Thus,the wafer in the cassette will not be polluted by the particle in theair during transportation.

[0007] However, the frame cassette is made according to the SEMI G770699standard and cannot be transported by the present personal guidedvehicle. Therefore, to improve the productivity and decrease the wasteof manpower during the semiconductor package process, the presentinvention discloses a frame cassette which can be transported by thepersonal guided vehicle. Thus, the conventional personal guided vehiclecan transport not only the cassette but also the frame cassette.

SUMMARY OF THE INVENTION

[0008] A major object of the present invention is to provide a framecassette, which can be transported by a personal guided vehicle fordecreasing the waste of manpower and improving the productivity.

[0009] In order to achieve the above object and to avoid thedisadvantages of the prior art, the present invention discloses a framecassette, comprising:

[0010] a case, being a hollow parallelepiped with a front opening,having a bottom wall and a top wall parallel with each other, and a leftside wall, a right side wall and a rear side wall perpendicular to thetop wall and the bottom wall; and

[0011] a plurality of frames for adhering and fixing cut wafers;

[0012] characterized in that: a positioning hole is disposed on near theboundary between the bottom wall and the left side wall and the rightside wall for fixing the frame cassette on a personal guided vehicle.

[0013] The foregoing and other objects and advantages of the inventionand the manner in which the same are accomplished will become clearerbased on the following detailed description taken in conjunction withthe accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014]FIG. 1 is a perspective view of a conventional frame cassette;

[0015] FIGS. 2(a) and 2(b) are perspective views illustrating thestructure of a conventional personal guided vehicle; and

[0016]FIG. 3 is a perspective view of a frame cassette of a preferredembodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0017] As shown in FIG. 3, a frame cassette 30 of one preferredembodiment of the present invention comprises a case 31 and a pluralityof frames 32. The case 32 is hollow parallelepiped with a front opening31 and includes a top wall 313 and bottom wall 312 parallel with eachother, and a left side wall 311, a right side wall 310 and a rear sidewall 314 perpendicular to the top wall 313 and the bottom wall 312. Ahandle (not shown) is disposed on the top wall 313 of the case 31 forholding the frame cassette. A fasten means 3 18 is disposed on thebottom wall 312 to fasten the frame cassette 30 on the loading port ofthe machine (not shown). Moreover, a plurality of grooves 315 areprovided oppositely on the inside of the left side wall 311 and theright side wall 310 of the case 31 for placing the plurality of frames32, so that the breakage of the wafer due to the friction between framesis avoided. For example, the frame cassette 30 for placing 12-inch waferhas 13 grooves 315. A fastener 316 is disposed in the front of the leftside wall 311 or the right side wall 310 for fastening the frame 32 inthe frame cassette 30, so that the frame shaking or falling out of theframe cassette 30 is avoided. The interval between the left side wall311 and the right side wall 310 of the frame cassette 30 is the same asthat between two sliding trenches 212 of the personal guided vehicle 20(as shown in FIG. 2(a) and FIG. 2(b)).

[0018] The feature of the frame cassette 30 of the present invention isthat a positioning hole 319 is disposed on near the boundary of thebottom wall 312 and the left and right side walls 311, 310,respectively. A protrusion 213 on the sliding trench 212 of the personalguided vehicle 20 will be inserted into the positioning hole 319 on thebottom wall of the frame cassette 30, while the frame cassette of thepresent invention is placed on the personal guided vehicle 20 (as shownin FIG. 2(a) and FIG. 2(b)). Therefore, the frame cassette 30 can bepositioned on the personal guided vehicle 20 for transporting or loadinginto a machine. In this case, the personal guided vehicle can transportnot only the cassette but also the frame cassette.

[0019] The technical contents and features of this invention have beensufficiently described in the above descriptions. It should beunderstood that any modifications or changes without departing from thespirits of the invention are intended to be covered in the protectionscope of the invention.

What is claimed is:
 1. A frame cassette applied to a personal guidedvehicle for transferring a semiconductor wafer, comprising: a case,being a hollow parallelepiped with a front opening, having a bottom walland a top wall parallel with each other, and a left side wall, a rightside wall and a rear side wall perpendicular to the top wall and thebottom wall; and a plurality of frames for adhering and fixing cutwafers; characterized in that: a positioning hole is disposed on nearthe boundary between the bottom wall and the left side wall and theright side wall to fix the frame cassette on a personal guided vehicle.2. The frame cassette of claim 1, which is able to be applied to a12-inch wafer.
 3. The frame cassette of claim 1, wherein inside the leftand the right side walls of the case are oppositely provided with aplurality of grooves for placing a plurality of the frames.
 4. The framecassette of claim 1, wherein inside the left and the right side walls ofthe case are oppositely provided with 13 grooves.